Infineon, Polyn in tie-up to advance tire monitoring systems

Munich, Germany – UK semiconductor company Polyn Technology and German automotive semiconductor supplier Infineon Technologies are jointly developing a new vibration-based tire monitoring system.

As part of the collaboration, Polyn will supply 'neuromorphic analog signal processing and neuromorphic front-end' (NASP NFE) chips to enable vibration-data pre-processing on tire sensors.

Infineon will use the technology on a new generation of tire pressure monitoring system (TPMS) sensors with tire-vibration signal detection, said London-based Polyn in a statement 15 Dec.

The NASP NFE technology, it added, will be integrated into Infineon’s TPMS SP49, to create a “solution with high performance at the lowest available power and highest reliability”.

The microchips, explained Polyn, contain “a neural network extracting vibration patterns for tire and road condition analysis.”

Furthermore, it said, they increase the volume of data collected from TPMS accelerometers "by a factor of 4000 at extremely low power consumption of only few microwatts."

The monitoring system will be especially suited to the fleet market and to autonomous cars: delivering data on road conditions and tire-wear, said Henry Hu of Infineon’s automotive division.