4 Jul 2018
Schwalbach, Germany – Dow is highlighting the role of rubber-to-metal-bonding technologies in automotive under-the-hood, powertrain and chassis anti-vibration applications.
The company’s portfolio includes Megum and other Thixon rubber-to-substrate bonding agents, new Thixon P-11-F and P-22 primer systems.
These offerings are said to provide performance and competitive cost with a REACH-compliant octylphenol-free formulation.
“Dow has produced robust, flexible primers for many applications,” said Dr. Stefan Dehnicke, global technology manager - specialty adhesives at Dow Automotive.
“This enables primer standardization and consolidation while meeting key industry performance requirements,” he added.
Thixon P-11-F and P-22 octylphenol-free primers can be used separately or together with cover agents. They are billed as “robust, flexible primers for various substrates.”
Advantages claimed include: High performance across key parameters for one- and two-coat bonding ; passing requirements for boiling water and salt-spray tests , balanced formulation free of MIBK (Thixon P-22).
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